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INTEGRATED CIRCUITS
DATA SHEET
TDA8708A Video analog input interface
Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 June 1994
Philips Semiconductors
Philips Semiconductors
Product specification
Video analog input interface
FEATURES * 8-bit resolution * Sampling rate up to 32 MHz * Binary or two's complement 3-state TTL outputs * TTL-compatible digital inputs and outputs * Internal reference voltage regulator * Power dissipation of 365 mW (typical) * Input selector circuit (one out of three video inputs) * Clamp and Automatic Gain Control (AGC) functions for CVBS and Y signals * No sample-and-hold circuit required. * The TDA8708A has white peak control in modes 1 and 2 whereas the TDA8708B has control in mode 1 only. GENERAL DESCRIPTION APPLICATIONS * Video signal decoding
TDA8708A
* Scrambled TV (encoding and decoding) * Digital picture processing * Frame grabbing.
The TDA8708A is an analog input interface for video signal processing. It includes a video amplifier with clamp and gain control, an 8-bit analog-to-digital converter (ADC) with a sampling rate of 32 MHz and an input selector.
QUICK REFERENCE DATA SYMBOL VCCA VCCD VCCO ICCA ICCD ICCO ILE DLE fclk(max) B Ptot PARAMETER analog supply voltage digital supply voltage TTL output supply voltage analog supply current digital supply current TTL output supply current DC integral linearity error DC differential linearity error maximum clock frequency maximum -3 dB bandwidth (AGC amplifier) total power dissipation MIN. 4.5 4.5 4.2 - - - - - 30 12 - TYP. 5.0 5.0 5.0 37 24 12 - - 32 18 365 MAX. 5.5 5.5 5.5 45 30 16 1 0.5 - - 500 V V V mA mA mA LSB LSB MHz MHz mW UNIT
ORDERING INFORMATION PACKAGE TYPE NUMBER PINS TDA8708A TDA8708AT 28 28 PIN POSITION DIP SO28L MATERIAL plastic plastic CODE SOT117-1 SOT136-1
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Philips Semiconductors
Product specification
Video analog input interface
BLOCK DIAGRAM
TDA8708A
andbook, full pagewidth
video input selection bit 0 14
video input selection bit 1 15
analog voltage output 19
ADC input 20
clock input 5
decoupling input 21
TTL outputs V CCO (+ 5 V) 7 9 output format/ chip enable (3-state input) D7 D6 D5 D4 D3 D2 D1 D0
VIDEO AMPLIFIER
video input 0 video input 1 video input 2 clamp capacitor connection AGC capacitor connection
16 17 18 24 25 TTL OUTPUTS INPUT SELECTOR AMP. 8 - bit ADC
1 2 3 4 10 11 12
TDA8708A
AGC & CLAMP LOGIC & MODE SELECTION peak level current resistor input 28
PEAK LEVEL DIGITAL COMPARATOR BLACK LEVEL DIGITAL COMPARATOR SYNC LEVEL DIGITAL COMPARATOR
13
27 sync level sync pulse
26 black level sync pulse
6 digital VCCD (+ 5 V)
8 digital ground
22 analog VCCA (+ 5 V)
23 analog ground
MBB965
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
Video analog input interface
PINNING SYMBOL D7 D6 D5 D4 CLK VCCD VCCO DGND OF D3 D2 D1 D0 I0 I1 VIN0 VIN1 VIN2 ANOUT ADCIN DEC VCCA AGND CLAMP AGC GATE B GATE A RPEAK PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 DESCRIPTION data output; bit 7 (MSB) data output; bit 6 data output; bit 5 data output; bit 4 clock input digital supply voltage (+5 V) TTL outputs supply voltage (+5 V) digital ground output format/chip enable (3-state input) data output; bit 3 data output; bit 2 data output; bit 1 data output; bit 0 (LSB) video input selection bit 0 video input selection bit 1 video input 0 video input 1 video input 2 analog voltage output analog-to-digital converter input decoupling input analog supply voltage (+5 V) analog ground clamp capacitor connection AGC capacitor connection black level synchronization pulse sync level synchronization pulse peak level current resistor input
D2 11 D1 12 D0 13 I0 14
MBB964
TDA8708A
D7 D6 D5 D4 CLK VCCD VCCO DGND OF
1 2 3 4 5 6 7 TDA8708A 8 9
28 RPEAK 27 GATE A 26 GATE B 25 AGC 24 CLAMP 23 AGND 22 VCCA 21 DEC 20 ADCIN 19 ANOUT 18 VIN2 17 VIN1 16 VIN0 15 I1
D3 10
Fig.2 Pin configuration.
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Philips Semiconductors
Product specification
Video analog input interface
FUNCTIONAL DESCRIPTION The TDA8708A provides a simple interface for decoding video signals. The TDA8708A operates in configuration mode 1 (see Fig.4) when the video signals are weak (i.e. when the gain of the AGC amplifier has not yet reached its optimum value). This enables a fast recovery of the synchronization pulses in the decoder circuit. When the pulses at the GATE A and GATE B inputs become distinct (GATE A and GATE B pulses are synchronization pulses occurring during the sync period and rear porch respectively) the TDA8708A automatically switches to configuration mode 2 (see Fig.5). When the TDA8708A is in configuration mode 1, the gain of the AGC amplifier will be roughly adjusted (sync level to a digital output level of 0 and the peak level to a digital output level of 255). In configuration mode 2 the digital output of the ADC is compared to internal digital reference levels. The resultant outputs control the charge or discharge current of a capacitor connected to the AGC pin. The voltage across this capacitor controls the gain of the video amplifier. This is the gain control loop.
TDA8708A
The sync level comparator is active during a positive-going pulse at the GATE A input. This means that the sync pulse of the composite video signal is used as an amplitude reference. The bottom of the sync pulse is adjusted to obtain a digital output of logic 0 at the converter output. As the black level is at digital level 64, the sync pulse will have a digital amplitude of 64 LSBs. The peak-white control loop is always active. If the video signal tends to exceed the digital code of 248, the gain will be limited to avoid any over-range of the converter. The use of nominal signals will prevent the output from exceeding a digital code of 213 and the peak-white control loop will be non-active. The clamp level control is accomplished by using the same techniques as used for the gain control. The black-level digital comparator is active during a positive-going pulse at the GATE B input. The clamp capacitor will be charged or discharged to adjust the digital output to code 64.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCCA VCCD VCCO VCC digital supply voltage output supply voltage supply voltage difference between VCCA and VCCD supply voltage difference between VCCO and VCCD supply voltage difference between VCCA and VCCO VI IO Tstg Tamb Tj input voltage output current storage temperature operating ambient temperature junction temperature PARAMETER analog supply voltage MIN. -0.3 -0.3 -0.3 -1.0 -1.0 -1.0 -0.3 0 -55 0 0 MAX. +7.0 +7.0 +7.0 +1.0 +1.0 +1.0 VCCA +10 +150 +70 +125 V V V V V V V mA C C C UNIT
THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT117-1 SOT136-1 June 1994 5 PARAMETER thermal resistance from junction to ambient in free air 55 70 K/W K/W VALUE UNIT
Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
CHARACTERISTICS VCCA = V22 to V23 = 4.5 to 5.5 V; VCCD = V6 to V8 = 4.5 to 5.5 V; VCCO = V7 to V8 = 4.2 to 5.5 V; AGND and DGND shorted together; VCCA to VCCD = -0.5 to +0.5 V; VCCO to VCCD = -0.5 to +0.5 V; VCCA to VCCO = -0.5 to +0.5 V; Tamb = 0 to +70 C; typical readings taken at VCCA = VCCD = VCCO = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VCCA VCCD VCCO ICCA ICCD ICCO analog supply voltage digital supply voltage TTL output supply voltage analog supply current digital supply current TTL output supply current TTL load (see Fig.8) 4.5 4.5 4.2 - - - 5.0 5.0 5.0 37 24 12 5.5 5.5 5.5 45 30 16 V V V mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Video amplifier inputs VIN(0 TO 2) INPUTS VI(p-p) |Zi| CI VIL VIH IIL IIH VIL VIH IIL IIH tW I28(min) V25(min) V25(max) input voltage (peak-to-peak value) input impedance input capacitance AGC load with external capacitor; note 1 fi = 6 MHz fi = 6 MHz 0.6 10 - 0 2.0 VI = 0.4 V VI = 2.7 V -400 - 0 2.0 VI = 0.4 V VI = 2.7 V see Fig.5 R28 = 0 -400 - 2 - - - - 20 1 - - - - - - - - - 80 1.5 - - 0.8 VCCD - 20 V k pF
I0 AND I1 TTL INPUTS (SEE TABLE 1) LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current V V A A V V A A s A V V
GATE A AND GATE B TTL INPUTS (SEE FIGS 4 AND 5) LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current pulse width 0.8 VCCD - 20 - 150 - -
RPEAK INPUT (PIN 28) minimum peak level current
AGC INPUT (PIN 25) AGC voltage for minimum gain AGC voltage for maximum gain AGC output current CLAMP INPUT (PIN 24) V24 I24 clamp voltage for code 128 output clamp output current - 3.5 see Table 3 - V 2.8 4.0 see Table 2
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Video amplifier outputs ANOUT OUTPUT (PIN 19) V19(p-p) I19 IO(p-p) V19 Z19 ct Gdiff diff B S/N SVRR1 G Gstab AC output voltage (peak-to-peak value) internal current source output current driven by the load DC output voltage for black level output impedance VVIN = 1.33 V (p-p); V25 = 3.6 V RL = VANOUT = 1.33 V (p-p); note 2 note 3 - 2.0 - - - - - - 12 note 4 note 5 see Fig.10 see Fig.10 60 - -4.5 - 1.33 2.5 - - - 1.0 V mA mA V
VCCA - 2.24 - 20 -50 2 0.8 - - 45 - - - -45 - - - - - +6.0 5
Video amplifier dynamic characteristics crosstalk between VIN inputs differential gain differential phase -3 dB bandwidth signal-to-noise ratio supply voltage ripple rejection gain range gain stability as a function of supply voltage and temperature VCCA = 4.75 to 5.25 V VVIN = 1.33 V (p-p); V25 = 3.6 V VVIN = 1.33 V (p-p); V25 = 3.6 V dB % deg MHz dB dB dB %
Analog-to-digital converter inputs CLK INPUT (PIN 5) VIL VIH IIL IIH |Zi| CI VIL VIH V9 IIL IIH LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current input impedance input capacitance Vclk = 0.4 V Vclk = 2.7 V fclk= 10 MHz fclk = 10 MHz 0 2.0 -400 - - - 0 2.6 - -370 - - - - - 4 4.5 - - 1.15 -300 300 0.8 VCCD - 100 - - 0.2 VCCD - - 450 V V A A k pF
OF INPUT (3-STATE; SEE TABLE 4) LOW level input voltage HIGH level input voltage input voltage in high impedance state LOW level input current HIGH level input current V V V A A
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
SYMBOL
PARAMETER
CONDITIONS - - - - fi = 6 MHz fi = 6 MHz - -
MIN.
TYP.
MAX.
UNIT
ADCIN INPUT (PIN 20; SEE TABLE 5) V20 V20 V20(p-p) I20 |Zi| CI input voltage input voltage input voltage amplitude (peak-to-peak value) input current input impedance input capacitance digital output = 00 digital output = 255 VCCA - 2.42 - VCCA - 1.41 - 1.0 1.0 50 1 - 10 - - V V V A M pF
Analog-to-digital converter outputs DIGITAL OUTPUTS D0 TO D7 VOL VOH IOZ fclk(max) LOW level output voltage HIGH level output voltage output current in 3-state mode IOL = 2 mA IOL = -0.4 mA 0.4 V < VO < VCCD see Fig.6; note 6 0 2.4 -20 - - - 0.6 VCCD +20 - - - 0 - 5 1 0.5 2 V V A
Switching characteristics maximum clock input frequency 30 - - - - - - - note 9 - 32 MHz
Analog signal processing (fclk = 32 MHz; see Fig.8) Gdiff diff f1 fall SVRR2 differential gain differential phase fundamental harmonics (full-scale) harmonics (full-scale); all components supply voltage ripple rejection V20 = 1.0 V (p-p); see Fig.3; note 7 see Fig.3; note 7 fi = 4.43 MHz; note 7 fi = 4.43 MHz; note 7 note 8 2 2 - -55 1 - - - % deg dB dB %/V
Transfer function (see Fig.8) ILE DLE ILE DC integral linearity error DC differential linearity error AC integral linearity error LSB LSB LSB
Timing (fclk = 32 MHz; see Figs 6, 7 and 8) DIGITAL OUTPUTS (CL = 15 pF; IOL = 2 mA; RL = 2 k) tds th td tdEZ tdDZ sampling delay time output hold time output delay time 3-state delay time; output enable 3-state delay time; output disable - 6 - - - 2 8 16 19 14 - - 20 25 20 ns ns ns ns ns
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Philips Semiconductors
Product specification
Video analog input interface
Notes 1. 0 dB is obtained at the AGC amplifier when applying Vi(p-p) = 1.33 V.
TDA8708A
2. The output current at pin 19 should not exceed 1 mA. The load impedance RL should be referenced to VCCA and defined as: a) AC impedance 1 k and the DC impedance >2.7 k. b) The load impedance should be coupled directly to the output of the amplifier so that the DC voltage supplied by the clamp is not disturbed. 3. Control mode 2 is selected. 4. Signal-to-noise ratio measured with 5 MHz bandwidth: V ANOUTC ( p - p ) S --- = 20 log ------------------------------------------------ at B = 5 MHz. V ANOUTY (RMS noise) N 5. The voltage ratio is expressed as: V CCA G SVRR1 = 20 log ----------------- x -------- for VI = 1 V (p-p), gain at 100 kHz = 1 and 1 V supply variation. V CCA G 6. It is recommended that the rise and fall times of the clock are 2 ns. In addition, a `good layout' for the digital and analog grounds is recommended. 7. These measurements are realized on analog signals after a digital-to-analog conversion (TDA8702 is used). 8. The supply voltage rejection is the relative variation of the analog signal (full-scale signal at input) for 1 V of supply variation: ( V I ( 00 ) - V I ( FF ) ) + ( V I ( 00 ) - V I ( FF ) ) SVRR2 = ----------------------------------------------------------------------------------------------------V CCA 9. Full-scale sine wave (fi = 4.4 MHz; fclk = 27 MHz).
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Philips Semiconductors
Product specification
Video analog input interface
Table 1 Video input selection (CVBS). I1 0 0 1 1 I0 0 1 0 1 SELECTED INPUT VIN0 VIN1 VIN2 VIN2 X(1) 0 Table 2 AGC output current. GATE A GATE B 1 0 1 1 X(1) 0 DIGITAL OUTPUT output < 255 output > 255 output < 248 output > 248 output < 0 0 < output < 248 IAGC -2.5 A IAGCM 0 A IAGCM +2.5 A -2.5 A MODE(2) 1 1 2 2 2 2 2 open Note 1. Use C 10 pF to DGND. Table 4 OF input coding. OF 0 1 circuit(1) Note 1. X = don't care. 0 1 1 1 Table 3 CLAMP output current. GATE A GATE B DIGITAL OUTPUT output < 0 output > 0 X(1) output < 64 64 < output
TDA8708A
ICLAMP ICLAMPM -2.5 A 0 A +50 A -50 A
MODE 1 1 2 2 2
D0 TO D7 active, two's complement high impedance active, binary
output > 248 IAGCM Note 1. X = don't care.
2. Mode 2 can only be initialized with successive pulses on GATE A and GATE B (see Fig.5). Table 5 Output coding and input voltage (typical values). BINARY OUTPUTS STEP Underflow 0 1 . . 254 255 Overflow VADCIN - VCCA - 2.41 V - - - - VCCA - 1.41 V - D7 0 0 0 . . 1 1 1 D6 0 0 0 . . 1 1 1 D5 0 0 0 . . 1 1 1 D4 0 0 0 . . 1 1 1 D3 0 0 0 . . 1 1 1 D2 0 0 0 . . 1 1 1 D1 0 0 0 . . 1 1 1 D0 0 0 1 . . 0 1 1 D7 1 1 1 . . 0 0 0 D6 0 0 0 . . 1 1 1 TWO'S COMPLEMENT D5 0 0 0 . . 1 1 1 D4 0 0 0 . . 1 1 1 D3 0 0 0 . . 1 1 1 D2 0 0 0 . . 1 1 1 D1 0 0 0 . . 1 1 1 D0 0 0 1 . . 0 1 1
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
handbook, full pagewidth
0.25 V
5 MHz sine wave
1.0 V
0.25 V
64 s
MBB959
Fig.3 Test signal on the ADCIN pin for differential gain and phase measurements.
ndbook, full pagewidth digital
output level peak-level gain control 255
MBB969
black-level clamping
sync-level gain control 0 GATE A time
GATE B
MODE 1
Fig.4 Control mode 1.
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
handbook, full pagewidth digital
output level
MBB970
248 peak-level gain control 213 standard picture level black-level clamping 64 sync-level control 0 GATE A tW tW
safety margin
time
GATE B
MODE 2
Fig.5 Control mode 2.
handbook, full pagewidth
CLK input t
clock input reference level (1.5 V) ds
sample N2 analog input (ADCIN) sample N1 sample N
sample N1
th 2.4 V data outputs data N 3 D0 to D7) data N 2 data N 1 data N data N 1 0.4 V td
MBB958
Fig.6 Timing diagram for data output.
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
handbook, full pagewidth
OF input
open
data outputs (D0 to D7)
high impedance two's complement binary
2.4 V
0.4 V t dDZ t dEZ
MBB968
Fig.7 Output format timing diagram.
V CCO
handbook, halfpage
2 k D0 to D7 15 pF IN916 or IN3064
MBD865
DGND
Fig.8 Load circuit for timing measurement; data outputs (OF = LOW or open-circuit).
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
V CCO
handbook, halfpage
2 k
S1 D0 to D7 C 5 k IN916 or IN3064
S2
MBB955
DGND
Fig.9 Load circuit for timing measurement; 3-state outputs (OF: fi = 1 MHz; VOF = 3 V).
12 G (dB) 8 5% 4
MSA676
0
(1) (2)
4
8 2.6
3
3.4
3.8
4.2
4.6 V 25 (V)
(1) Typical value (VCCA = VCCD = 5 V; Tamb = 25 C). (2) Minimum and maximum values (temperature and supply).
Fig.10 Gain control curve.
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handbook, full pagewidth
June 1994
pin 28 RPEAK pins 26 or 27 GATE A or GATE B VCCD VCCD I RPEAK pin 6 VCCD DGND AGND DGND VCCA pin 7 VCCO pin 22 VCCA pin 24 CLAMP VCCD VCCA pin 25 AGC
Philips Semiconductors
INTERNAL PIN CIRCUITRY
VCCO
pins 1 to 4 and 10 to 13 data outputs
DGND DGND
Video analog input interface
VCCD
pin 5 clock input
1.5 V
TDA8708A
I1 I1 I2
DGND
15
AGND VCCA VCCA 20 k 2.5 mA AGND pin 19 ANOUT AGND pin 20 ADCIN AGND
4 V BE
VCCD
pin 8 DGND pin 23 AGND VCCA
chip enable
pin 9 OF
binary/ two's complement
VREF
VCCA
DGND
V top Vmid
VCCA
pins 14 and 15 I0, I1
Vbottom AGND pin 21 DEC
VREF
AGND
pins 16 to 18 VIN0, VIN1 and VIN2
MBB971
Product specification
TDA8708A
Fig.11 Internal pin configuration.
Philips Semiconductors
Product specification
Video analog input interface
APPLICATION INFORMATION Additional information can be found in the laboratory report "FBL/AN9308".
TDA8708A
handbook, full pagewidth
330 1 28 horizontal sync
2 data outputs 3
27
26
horizontal clamp 220 nF
4 100 clock 33 pF 5
25 18 nF 24
6 22 nF
(1)
23 1F 10 nF 1 H 5V 1 F 5V
5V
22
7 22 nF 8 TDA8708A
22
21
9 10 pF 10
20 LOW PASS FILTER 19 4.7 F
(2)
11 data outputs 12
18 4.7 F 17 4.7 F 75 75 75
13
16
14
15
MBB967 - 1
(1) It is recommended to decouple VCCO through a 22 resistor especially when the output data of TDA8708A interfaces with a capacitive CMOS load device. (2) See Figs 13 and 15 for examples of the low-pass filters.
Fig.12 Application diagram.
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
22 H
dbook, full pagewidth
22 H
ANOUT (pin 19) Vi
680
12 pF
12 pF 2.2 k
ADCIN (pin 20) 27 pF
MBB966 - 1
27 pF
68 pF
Vo
VCCA (pin 22)
This filter can be adapted to various applications with respect to performance requirements. An input and output impedance of at least 680 and 2.2 k must in any event be applied.
Fig.13 Example of a low-pass filter for CVBS and Y signals.
Characteristics of Fig. 13 * Order 5; adapted CHEBYSHEV
handbook, halfpage
0
MSA682
* Ripple 0.4 dB * f = 6.5 MHz at -3 dB * fnotch = 9.75 MHz.
(dB)
40
80
120
160
0
10
20
f (MHz)
30
Fig.14 Frequency response for filter shown in Fig.13.
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
handbook, full pagewidth
ADOUT (pin 19) Vi
680
82 H 2.2 k 15 pF 15 pF
MSA678
ADCIN (pin 20) Vo
VCCA (pin 22)
This filter can be adapted to various applications with respect to performance requirements. An input and output impedance of at least 680 and 2.2 k must in any event be applied.
Fig.15 Example of an economical low-pass filter for CVBS and Y signals.
Characteristics of Fig. 15 * Order 5; adapted CHEBYSHEV
handbook, halfpage
0
MSA681
* Ripple 0.4 dB * f = 6.5 MHz at -3 dB.
(dB)
10
20
30
40
0
10
20
f (MHz)
30
Fig.16 Frequency response for filter shown in Fig.15.
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Philips Semiconductors
Product specification
Video analog input interface
PACKAGE OUTLINES
TDA8708A
handbook, full pagewidth
seating plane
36.0 35.0 4.0 5.1 max max
15.80 15.24
3.9 3.4
0.51 min 0.254 M 0.32 max 15.24 17.15 15.90
MSA264
1.7 max
2.54 (13x) 1.7 max
0.53 max
28
15
14.1 13.7
1
14
Dimensions in mm.
Fig.17 Plastic dual in-line package; 28 leads (600 mil) with internal heat spreader (SOT117-1).
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Philips Semiconductors
Product specification
Video analog input interface
TDA8708A
handbook, full pagewidth
18.1 17.7
7.6 7.4 A
S 0.9 (4x) 0.4
0.1 S
10.65 10.00
28
15 2.45 2.25 1.1 1.0 0.3 0.1 0.32 0.23 1.1 0.5 detail A 2.65 2.35
pin 1 index 1 14 0 to 8o
MBC236 - 1
1.27
0.49 0.36
0.25 M (28x)
Dimensions in mm.
Fig.18 Plastic small outline package; 28 leads; large body (SOT136-1).
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Philips Semiconductors
Product specification
Video analog input interface
SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. Plastic small-outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C.
TDA8708A
A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
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Philips Semiconductors
Product specification
Video analog input interface
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8708A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Philips Semiconductors
Product specification
Video analog input interface
NOTES
TDA8708A
June 1994
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Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2327, Fax. (011)829-1849 Canada: INTEGRATED CIRCUITS: Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 601 Milner Ave, SCARBOROUGH, ONTARIO, M1B 1M8, Tel. (0416)292 5161 ext. 2336, Fax. (0416)292 4477 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: PHILIPS COMPONENTS UB der Philips G.m.b.H., P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., Components Div., 6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)428 6729 India: Philips INDIA Ltd, Components Dept, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: PHILIPS COMPONENTS S.r.l., Viale F. Testi, 327, 20162 MILANO, Tel. (02)6752.3302, Fax. (02)6752 3300. Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: Philips Components, 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)14163160/4163333, Fax. (01)14163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., Components Division, 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382. Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)269 3094 United Kingdom: Philips Semiconductors Limited, P.O. Box 65, Philips House, Torrington Place, LONDON, WC1E 7HD, Tel. (071)436 41 44, Fax. (071)323 03 42 United States: INTEGRATED CIRCUITS: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd., P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404, Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BAF-1, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD31 (c) Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/05/pp24 Document order number: Date of release: June 1994 9397 734 20011
Philips Semiconductors

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